Electronic applications – our products for high-tech uses
Some of our electroplating chemicals are used in electronics, where they serve as base substances for the formulation of baths to precipitate metal and alloy layers in the production and functionalisation of circuit boards, semi-conductor elements and connectors.
It is primarily our metal methane sulphonates that can be used for the formulation of electroplating baths in the electronics sector. It was our customers’ interest in lead-free plumbs that once led to the development of such electrolytes. We have accompanied our customers here right from the start and do so even before applicable European and international guidelines take effect.
We also provide very pure tin, copper and nickel salts for classic plating baths in the electronics sector. These products are dependably pure, which facilitates their use in such sensitive application environments.
|Tin(II) methane sulphonate solution||220 g/l, 300 g/l und 400 g/l Sn|
|Copper(II) methane sulphonate solution||up to 125/l Cu, ca. 50 g/l free acid|
|Silver(I) methane sulphonate solution||up to 275 g/l Ag, ca. 50 g/l free acid|
|Bismuth(III) methane sulphonate solution||210 g/l Bi, 100–200 g/l free acid|
|Cobalt(II) methane sulphonate solution||120 g/l Co, ca. 10 g/l free acid|
|Indium(III) methane sulphonate solution||120 g/l In, ca. 30 g/l free acid|
|Tin(II) sulphate||crystalline and as a solution 125 g/l Sn|
|TIB SpeedPlate||formulation for the acidic tin plating of copper and copper alloy surfaces based upon tin sulphate|
|Copper(II) oxide EPG||very pure replenisher for copper baths in circuit board production|
|Sulphuric acid||up to 98 %|
|Methane sulphonic acid||70 %|
|TIB Suract ETG||2,2-Ethylendithiodiethanole|
|TIB Suract TPB/TPB 10||solubilised benzalacetone 3 %/10 %|
|TIB Suract DRY||modified fatty amide in an aqueous solution|
|TIB Lux OV/OV 21||peroxide stabiliser|
|TIB SpeedPlate Plus||additive for dip-tinning baths|