For Metal Finishing

Organic process additives as electroplating chemicals

Our range of organic process additives for electroplating applications includes both intermediates and mixtures. Organic intermediates – but especially surfactants – are important raw materials for the formulation of electroplating baths. They act as grain refiners, brighteners or as solubilisers for other bath components. Our ready-to-use formulations contain fine-tuned components for specific applications in electroplating, e.g. for the pre-treatment and post-processing of coated components. In the special case of electroless tin plating, we offer application-ready processes for the plating of aluminium and copper components with TIB Stanal and TIB SpeedPlate. The TIB Suract DRY formulation from TIB Chemicals ensures energy savings during drying processes. Major advantage: the product works at room temperature and works on all types of metal surfaces. TIB Suract DRY was originally developed for the fast and uncomplicated drying of freshly tinned printed circuit board tracks. The aim was to avoid corrosion phenomena without affecting the soldering properties of the tin surface. The hydrophobic film that forms at room temperature allows the component surface to dry quickly even with unfavourable geometry and provides temporary protection against corrosion during subsequent storage. If the film needs to be removed for further processing of the component, no additional chemicals are required: A short rinse with hot water is sufficient. Fluorosurfactants are extremely stable wetting agents for demanding chemical environments, such as chromic acid-based chrome plating baths. However, the stability of fluorosurfactants also accounts for their high persistence and bioaccumulability, which is why they are to be replaced in most applications. With TIB Suract CR-H, TIB Chemicals offers a fluorosurfactant-free alternative for bright, black and even hard chrome plating baths. The advantages are obvious: the patented active ingredient is completely biodegradable. At the same time, its effectiveness in chromic acid baths is guaranteed. Important is the constant addition of a highly diluted solution of the additive during the plating process.

Tade name Description Chem. formula CAS No.

TIB Lux BN 13

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For the formulation of brightener systems - -

TIB Lux NPS

Grain refiner

TIB Lux OV / OV 21

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Peroxide stabiliser for pickling and brightening - -

TIB SpeedPlate plus

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Grain refiner for immersion tin plating - -

TIB Stanal CL

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For sulphuric acid pickling baths - -

TIB Stanal CP

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For nitric acid pickling baths - -

TIB Stanal DG

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For alkaline degreasing - -

TIB Stanal DG-B

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Demulsifier for alkaline degreasing - -

TIB Stanal TP

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For immersion tin plating on aluminium surfaces - -

TIB Stanno Plus

For the electrolytic colouring of aluminium surfaces

TIB Suract A25

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For avoiding pores during electroless nickel plating - -

TIB Suract A40

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For avoiding pores during electroless nickel plating - -

TIB Suract AC 101

For metal finishing applications

TIB Suract B30 P

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Weting agent for degreasing and rinse baths - -

TIB Suract B35

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Wetting agent for copper plating baths - -

TIB Suract B38 C

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Wetting agent for copper plating baths - -

TIB Suract CR-H

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Fluorine-free wetting agent for chrome plating baths - -

TIB Suract DRY

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Hydrophobing agent - -

TIB Suract E00 P

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De-foaming agent - -

TIB Suract ETG

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Complexing agent for precious metals - -

TIB Suract L 101

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Emulsifier for alkaline degreasing - -

TIB Suract N19

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For solubilising benzalacetone - -

TIB Suract TPB / TPB 10

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Grain refiner for tin plating baths - -

TIB Suract Trigonellin 20

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Brightener for alkaline zinc and zinc/nickel baths - -

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