Copper Salts

Copper Salts for Electroplating

Plating of copper and copper alloys is important for all types of metal finishing processes. Our copper containing products are used primarily for functional plating, as in PCB production for example. They are therefore characterised particularly by low levels of critical impurities.

Tade name Description Chem. formula CAS No.

Copper(II) acetate monohydrate

Cu(OAc)2·H2O 6046-93-1

Cu(OAc)2·H2O 6046-93-1

Copper(II) acetate solution

Cu(OAc)2 6046-93-1

Cu(OAc)2 6046-93-1

Copper(II) chloride dihydrate

CuCl2·2 H2O 10125-13-0

CuCl2·2 H2O 10125-13-0

Copper(II) fluoroborate solution

Cu(BF4)2 207121-39-9

Cu(BF4)2 207121-39-9

Copper(II) nitrate hemipentahydrate

Cu(NO3)2·2.5 H2O 19004-19-4

Cu(NO3)2·2.5 H2O 19004-19-4

Copper(II) nitrate solution

Cu(NO3)2 3251-23-8

Cu(NO3)2 3251-23-8

Copper(II) oxide EPG

CuO 1317-38-0

Copper(II) oxide electroplating grade CuO 1317-38-0

Copper(II) sulphate solution EPG

CuSO4 7758-98-7

CuSO4 7758-98-7

Kupfer(II) pyrophosphate tetrahydrate

Cu2P2O7·4 H2O 15191-80-7

Cu2P2O7·4 H2O 15191-80-7

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in the range Copper Salts