Copper Salts
Valuable raw materials for functional plating bath formulations
Plating of copper and copper alloys is important for all types of metal finishing processes. Our copper containing products are used primarily for functional plating, as in PCB production for example. Moreover, in the automotive industry copper salts are raw materials as well, e.g. for bearing plating. Our products are therefore characterised particularly by low levels of critical impurities.
| Tade name | Description | Chem. formula | CAS No. | |||
|---|---|---|---|---|---|---|
|
Copper(II) acetate monohydrate Cu(OAc)2·H2O 6046-93-1 |
Cu(OAc)2·H2O | 6046-93-1 | ||||
|
Copper(II) acetate solution Cu(OAc)2 6046-93-1 |
Cu(OAc)2 | 6046-93-1 | ||||
|
Copper(II) chloride dihydrate CuCl2·2 H2O 10125-13-0 |
CuCl2·2 H2O | 10125-13-0 | ||||
|
Copper(II) fluoroborate solution Cu(BF4)2 207121-39-9 |
Cu(BF4)2 | 207121-39-9 | ||||
|
Copper(II) nitrate hemipentahydrate Cu(NO3)2·2.5 H2O 19004-19-4 |
Cu(NO3)2·2.5 H2O | 19004-19-4 | ||||
|
Copper(II) nitrate solution Cu(NO3)2 3251-23-8 |
Cu(NO3)2 | 3251-23-8 | ||||
|
Copper(II) oxide EPG CuO 1317-38-0 |
Copper(II) oxide electroplating grade | CuO | 1317-38-0 | |||
|
Copper(II) sulphate solution EPG CuSO4 7758-98-7 |
CuSO4 | 7758-98-7 | ||||
|
Kupfer(II) pyrophosphate tetrahydrate Cu2P2O7·4 H2O 15191-80-7 |
Cu2P2O7·4 H2O | 15191-80-7 |