Electroplating
Chemicals for electroplating – basic salts and intermediates for demanding electroplating applications
With the electroplating chemicals from TIB Chemicals, customers can rely on many years of experience and practice-oriented know-how: Starting with raw materials such as tin sulphate for traditional tin baths, we have been supplying our customers with high-quality metal compounds since the 1980s. In doing so, we are always reacting to new requirements, so that our portfolio is constantly expanding. This is expemlified by our metal methanesulphonates as well as our products for cyanide-free bath formulations or a fluorosurfactant-free chrome bath wetting agent.
From standard products to new developments and contract manufacturing: Electroplating from TIB Chemicals
Our electroplating know-how in the form of highly developed bath formulations is used in all applications – from a chrome sheen on decorative surfaces and filigree contacts on printed circuit boards to wear-resistant tin coatings on engine pistons and façade components made of electrolytically coloured aluminium.Our customers can alsways rely on us having raw materials available worldwide in sufficient quantities at a consistently high quality, at the right time and in a suitable form. From metal salts as bath bases to organic intermediates for special additives – it is almost always worth taking a look at the product range of TIB Chemicals. What is more, we are constantly developing new problem solutions for our customers: wherever in the world a new electroplating bath is being developed – we are always amongst the first when it comes to securing the raw materials, some of which are completely new. This expressly includes exclusive contract manufacturing.
From automotive to tin surface: Electroplating in application
Electroplating chemicals from TIB Chemicals are primarily used by specialist companies and other formulation proprietors. They serve as raw materials for formulations of galvanic processes in order to deposit decorative as well as functional surface layers. In addition to metal salts and their solutions, our organic additives are also used for special bath properties. The portfolio includes metal chemicals, especially for tin, nickel, copper and Zinc. Thanks to careful raw material selection and reliable process control, these basic salts are characterised by high quality. In addition, we have been supplying companies in the automotive supply industry for decades, where our products are used for the chemical or electrolytic tin-plating of bearings and pistons.
Indispensable for the electronics industry: Metal methanesulphonates
TIB Chemicals offers the world's broadest range of metal methanesulphonates. They are suitable for formulating electroplating baths, especially in the electronics sector – typically for depositing metal and alloy layers in printed circuit boards and connectors. Our customers’ focus on lead-free solders strongly promoted the development of such electrolytes years ago. TIB Chemicals has supported this path from the very beginning: even before the relevant directives came into effect, we ensured progress in this demanding bath chemistry segment with our basic salts. Thus, the product group of metal methane sulphonates fulfils the highest demands on purity and stability.
| Tade name | Description | Chem. formula | CAS No. |
|---|---|---|---|
|
Bismuth(III) methanesulphonate solution 210 g/l Bi Bi(CH3SO3)3 82617-81-0 |
Bi(CH3SO3)3 | 82617-81-0 | |
|
Chromium(III) chloride solution 50 % CrCl3 10025-73-7 |
CrCl3 | 10025-73-7 | |
|
Chromium(III) hydrogenphosphate solution 20 % Cr(H2PO4)3 59178-46-0 |
Cr(H2PO4)3 | 59178-46-0 | |
|
Chromium(III) methanesulphonate solution 100 g/l Cr Cr(CH3SO3)3 55136-34-0 |
Cr(CH3SO3)3 | 55136-34-0 | |
|
Chromium(III) nitrate solution 74 % Cr(NO3)3 13548-38-4 |
Cr(NO3)3 | 13548-38-4 | |
|
Chromium(III) sulphate solution 50 % Cr2(SO4)3 10101-53-8 |
Cr2(SO4)3 | 10101-53-8 | |
|
Cobalt(II) methanesulphonate solution 120 g/l Co Co(CH3SO3)2 55136-37-3 |
Co(CH3SO3)2 | 55136-37-3 | |
|
Copper(II) fluoroborate solution Cu(BF4)2 207121-39-9 |
Cu(BF4)2 | 207121-39-9 | |
|
Copper(II) methanesulphonate solution 125 g/l Cu Cu(CH3SO3)2 54253-62-2 |
Cu(CH3SO3)2 | 54253-62-2 | |
|
Copper(II) sulphate solution EPG CuSO4 7758-98-7 |
CuSO4 | 7758-98-7 | |
|
Fluoroboric acid 50 % HBF4 16872-11-0 |
HBF4 | 16872-11-0 | |
|
Hydroxyethanesulphonic acid 70 % C2H5O3S 107-36-8 |
C2H5O3S | 107-36-8 | |
|
Iron(II) methanesulphonate solution 120 g/l Fe Fe(CH3SO3)2 56525-23-6 |
Fe(CH3SO3)2 | 56525-23-6 | |
|
Kupfer(II) pyrophosphate tetrahydrate Cu2P2O7·4 H2O 15191-80-7 |
Cu2P2O7·4 H2O | 15191-80-7 | |
|
Lead fluoroborate solution Pb(BF4)2 13814-96-5 |
Pb(BF4)2 | 13814-96-5 | |
|
Lead(II) methanesulphonate solution 450 g/l Pb Pb(CH3SO3)2 17570-76-2 |
Pb(CH3SO3)2 | 17570-76-2 | |
|
Methanedisulphonic acid 50 % CH2(SO3H)2 503-40-2 |
CH2(SO3H)2 | 503-40-2 | |
|
Methanesulphonic acid 70 % CH3SO3H 75-75-2 |
CH3SO3H | 75-75-2 | |
|
Nickel acetate tetrahydrate Ni(OAc)2· 4 H2O 6018-89-9 |
Ni(OAc)2· 4 H2O | 6018-89-9 | |
|
Nickel phosphate solution Ni3(PO4)2 14448-18-1 |
Ni3(PO4)2 | 14448-18-1 | |
|
Nickel(II) methanesulphonate solution 100 g/l Ni Ni(CH3SO3)2 55136-38-4 |
Ni(CH3SO3)2 | 55136-38-4 | |
|
Potassium hexahydroxystannate K2Sn(OH)6 12027-61-1 |
K2Sn(OH)6 | 12027-61-1 | |
|
Potassium hexahydroxystannate solution K2Sn(OH)6 12027-61-1 |
K2Sn(OH)6 | 12027-61-1 | |
|
Potassium methanesulphonate solution 200 g/l Ka K(CH3SO3) 2386-56-3 |
K(CH3SO3) | 2386-56-3 | |
|
Silver(I)-methanesulphonate solution 275 g/l Ag Ag(CH3SO3) 2386-52-9 |
Ag(CH3SO3) | 2386-52-9 | |
|
Sodium hexahydroxystannate Na2Sn(OH)6 12209-98-2 |
Na2Sn(OH)6 | 12209-98-2 | |
|
Sodium hexahydroxystannate solution Na2Sn(OH)6 12209-98-2 |
Na2Sn(OH)6 | 12209-98-2 | |
|
Sodium methanesulphonate solution 120 g/l Na Na(CH3SO3) 2386-57-4 |
Na(CH3SO3) | 2386-57-4 | |
|
Sodium thiosulphate anhydrous Na2S2O3 7772-98-7 |
Na2S2O3 | 7772-98-7 | |
|
Sodium thiosulphate crystals Na2S2O3*5H2O 10102-17-7 |
Na2S2O3*5H2O | 10102-17-7 | |
|
Sulfosuccinic acid 70% C4H6O7S 5138-18-1 |
C4H6O7S | 5138-18-1 | |
|
Tin(II) chloride anhydrous SnCl2 7772-99-8 |
SnCl2 | 7772-99-8 | |
|
Tin(II) chloride dihydrate SnCl2·2 H2O 10025-69-1 | |
SnCl2·2 H2O | 10025-69-1 | | |
|
Tin(II) chloride solution SnCl2 7772-99-8 |
SnCl2 | 7772-99-8 | |
|
Tin(II) fluoroborate solution Sn(BF4)2 7488-55-3 |
Sn(BF4)2 | 7488-55-3 | |
|
Tin(II) methanesulphonate solution 300 g/l Sn Sn(CH3SO3)2 53408-94-9 |
Sn(CH3SO3)2 | 53408-94-9 | |
|
Tin(II) oxide SnO 21651-19-4 |
SnO | 21651-19-4 | |
|
Tin(II) pyrophosphate Sn2P2O7 15578-26-4 |
Sn2P2O7 | 15578-26-4 | |
|
wIndium(III) methanesulphonate solution 200 g/l In In(CH3SO3)3 128008-30-0 |
In(CH3SO3)3 | 128008-30-0 | |
|
Zinc methanesulphonate solution 120 g/l Zn Zn(CH3SO3)2 33684-80-9 |
Zn(CH3SO3)2 | 33684-80-9 | |
|
TIB Suract Trigonellin 20 - - |
Brightener for alkaline zinc and zinc/nickel baths | - | - |
|
Potassium methanedisulphonate K2(CH2SO6) 6291-65-2 |
Catalyst for chromic acid electrolytes | K2(CH2SO6) | 6291-65-2 |
|
TIB Suract ETG - - |
Complexing agent for precious metals | - | - |
|
TIB Suract E00 P - - |
De-foaming agent | - | - |
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TIB Stanal DG-B - - |
Demulsifier for alkaline degreasing | - | - |
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PROTEFAN Stoving varnish - - |
Emballage inner coating | - | - |
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TIB Suract L 101 - - |
Emulsifier for alkaline degreasing | - | - |
|
TIB Suract CR-H - - |
Fluorine-free wetting agent for chrome plating baths | - | - |
|
TIB Stanal DG - - |
For alkaline degreasing | - | - |
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TIB Suract A25 - - |
For avoiding pores during electroless nickel plating | - | - |
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TIB Suract A40 - - |
For avoiding pores during electroless nickel plating | - | - |
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TIB Stanal TP - - |
For immersion tin plating on aluminium surfaces | - | - |
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TIB Suract AC 101
|
For metal finishing applications | ||
|
TIB Stanal CP - - |
For nitric acid pickling baths | - | - |
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TIB Suract N19 - - |
For solubilising benzalacetone | - | - |
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TIB Stanal CL - - |
For sulphuric acid pickling baths | - | - |
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TIB Stanal TS - - |
For the electroless immersion tin plating on aluminium surfaces | - | - |
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TIB SpeedPlate - - |
For the electroless immersion tin plating on copper and brass surfaces | - | - |
|
TIB Stanno Plus
|
For the electrolytic colouring of aluminium surfaces | ||
|
TIB Stannocolor - - |
For the electrolytic colouring of aluminum surfaces (ELOXAL) | - | - |
|
TIB Lux BN 13 - - |
For the formulation of brightener systems | - | - |
|
PROTEFAN® dip coating 4000 - - |
Galvanic frame coating/PVC dip plastisol | - | - |
|
PROTEFAN® dip coating 4013 HS - - |
Galvanic frame coating/PVC dip plastisol | - | - |
|
PROTEFAN® dip coating 4015
|
Galvanic frame coating/PVC dip plastisol | ||
|
PROTEFAN® dip coating 4110 - - |
Galvanic frame coating/PVC dip plastisol | - | - |
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PROTEFAN® dip coating 4125
|
Galvanic frame coating/PVC dip plastisol | ||
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TIB Lux NPS
|
Grain refiner | ||
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TIB SpeedPlate plus - - |
Grain refiner for immersion tin plating | - | - |
|
TIB Suract TPB / TPB 10 - - |
Grain refiner for tin plating baths | - | - |
|
TIB Suract DRY - - |
Hydrophobing agent | - | - |
|
TIB Lux OV / OV 21 - - |
Peroxide stabiliser for pickling and brightening | - | - |
|
PRODORAL® Sealing H
|
Sealant / Sealing of heating installations | ||
|
PRODORAL® Sealing R6-1
|
Thread sealing for gas inner pipes | ||
|
Tin(II) sulphate crystalline EPG SnSO4 7488-55-3 |
Tin(II) sulphate electroplating grade | SnSO4 | 7488-55-3 |
|
TIB Suract B30 P - - |
Weting agent for degreasing and rinse baths | - | - |
|
TIB Suract B35 - - |
Wetting agent for copper plating baths | - | - |
|
TIB Suract B38 C - - |
Wetting agent for copper plating baths | - | - |
|
Copper(II) chloride dihydrate CuCl2·2 H2O 10125-13-0 |
CuCl2·2 H2O | 10125-13-0 | |
|
Copper(II) nitrate hemipentahydrate Cu(NO3)2·2.5 H2O 19004-19-4 |
Cu(NO3)2·2.5 H2O | 19004-19-4 | |
|
Copper(II) nitrate solution Cu(NO3)2 3251-23-8 |
Cu(NO3)2 | 3251-23-8 | |
|
TIB Zinc chloride ZnCl2 7646-85-7 |
Zinc chloride | ZnCl2 | 7646-85-7 |
|
TIB Zinc Chloride TG1 ZnCl2 7646-85-7 |
Zinc chloride solution 38-40 % standard | ZnCl2 | 7646-85-7 |
|
TIB Zinc Chloride TG4.1 ZnCl2 7646-85-7 |
Zinc chloride solution 40 % high quality | ZnCl2 | 7646-85-7 |
|
TIB Zinc Chloride TG4.2 ZnCl2 7646-85-7 |
Zinc chloride solution 40 % highest quality | ZnCl2 | 7646-85-7 |
|
TIB Zinc Chloride TG3.50 ZnCl2 7646-85-7 |
Zinc chloride solution 50 % | ZnCl2 | 7646-85-7 |
|
TIB Zinc Chloride TG3.60 ZnCl2 7646-85-7 |
Zinc chloride solution 65 % | ZnCl2 | 7646-85-7 |
|
TIB Zinc Chloride TG3.65 ZnCl2 7646-85-7 |
Zinc chloride solution 65 % | ZnCl2 | 7646-85-7 |
|
Copper(II) acetate monohydrate Cu(OAc)2·H2O 6046-93-1 |
Cu(OAc)2·H2O | 6046-93-1 | |
|
Copper(II) acetate solution Cu(OAc)2 6046-93-1 |
Cu(OAc)2 | 6046-93-1 | |
|
Nickel carbonate dry NiCO3·Ni(OH)2·xH2O 12607-70-4 |
NiCO3·Ni(OH)2·xH2O | 12607-70-4 | |
|
Nickel carbonate low dust NiCO3·Ni(OH)2·xH2O 12607-70-4 |
NiCO3·Ni(OH)2·xH2O | 12607-70-4 | |
|
Nickel carbonate moist NiCO3·Ni(OH)2·x H2O 12607-70-4 |
NiCO3·Ni(OH)2·x H2O | 12607-70-4 | |
|
Nickel carbonate pasty NiCO3·Ni(OH)2·xH2O 12607-70-4 |
NiCO3·Ni(OH)2·xH2O | 12607-70-4 | |
|
Nickel carbonate powder NiCO3·Ni(OH)2·xH2O 12607-70-4 |
NiCO3·Ni(OH)2·xH2O | 12607-70-4 | |
|
Nickel carbonate powder low dust NiCO3·Ni(OH)2·xH2O 12607-70-4 |
NiCO3·Ni(OH)2·xH2O | 12607-70-4 | |
|
Nickel chloride hexahydrate NiCl2·6 H2O 7791-20-0 |
NiCl2·6 H2O | 7791-20-0 | |
|
Nickel chloride solution NiCl2 7718-54-9 |
NiCl2 | 7718-54-9 | |
|
Nickel nitrate hexahydrate Ni(NO3)2·6H2O 13478-00-7 |
Ni(NO3)2·6H2O | 13478-00-7 | |
|
Nickel nitrate solution Ni(NO3)2 13138-45-9 |
Ni(NO3)2 | 13138-45-9 | |
|
Nickel sulfate heptahydrate NiSO4·7 H2O 10101-98-1 |
NiSO4·7 H2O | 10101-98-1 | |
|
Nickel sulfate solution NiSO4 7786-81-4 |
NiSO4 | 7786-81-4 | |
|
TIB Clean A 300
|
Low temperature alkaline degreaser | ||
|
Tin(II) sulphate solution SnSO4 7488-55-3 |
SnSO4 | 7488-55-3 | |
|
Copper(II) oxide EPG CuO 1317-38-0 |
Copper(II) oxide electroplating grade | CuO | 1317-38-0 |
|
TIB Zinc Citrate Zn3(C6H5O7)2 546-46-3 |
Zinc citrate powder | Zn3(C6H5O7)2 | 546-46-3 |
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